Materialise Embeds Native CAD Workflows Into Magics
Materialise will add native CAD workflows within Magics 26, providing an additional toolset on top of mesh functionality.
Latest in Additive Manufacturing
Additive Manufacturing Resources
December 7, 2021
With Parasolid technology, Materialise will add native CAD workflows within Magics 26, providing an additional toolset on top of mesh functionality. This combination of solutions will allow users to continue iterating CAD designs in Magics to prepare for additive manufacturing processes, improving productivity and providing cleaner, more accurate and fit-for-purpose data, according to the companies.
“For years, the 3D printing industry has discussed whether CAD or mesh is the preferred workflow for file preparation,” says Stefaan Motte, vice president Software for Materialise.
Magics 26 will enable users to transition from design optimization in CAD to mesh-based file preparation. This will enable users to easily review and edit parts with designers and engineers who are familiar with CAD systems before transitioning to mesh for platform and build preparation.
Developed by Siemens Digital Industries Software, Parasolid is a 3D geometric modeling kernel. Parasolid is at the core of the Siemens’ Xcelerator portfolio’s open and flexible ecosystem and has been adopted by more than 200 software vendors giving end-users 100% 3D model compatibility across 350+ Parasolid-based software applications.
Convergent ModelingT technology, a core part of the Parasolid solution, enables mesh data to be mixed with traditional CAD geometry in a unified environment. Magics users will benefit from CAD for part editing using technology and mesh-based operations for platform preparation.
Magics 26 will be released in spring 2022, powering additive manufacturers with a cohesive and fully integrated workflow for 3D printing.
Sources: Press materials received from the company and additional information gleaned from the company’s website.
More Materialise Coverage
More Siemens Digital Industries Software Coverage
About the Author
DE’s editors contribute news and new product announcements to Digital Engineering.
Press releases may be sent to them via DE-Editors@digitaleng.news.