Ansys Uses Flexium 5G Antenna Designs to Advance ADAS/AV
Ansys simulation drives the PCB manufacturer's 5G mmWave antenna module designs to support satellite, driverless and wireless applications.
Flexium uses Ansys’ simulation technology to design flexible print circuits modules matching various mechanical design. Image courtesy of Ansys.
July 18, 2023
Flexium uses Ansys simulation solutions to explore design ideas, and develop and test antenna modules for high-frequency signal transceiver designs used in advanced driver assistance systems (ADAS) and autonomous vehicle (AV) applications. With support from Ansys tools, the printed circuit board (PCB) manufacturer's R&D team can also test the durability and reliability of its PCB boards, as well as explore new design ideas through layout and material experimentation, the companies report.
Within Flexium's PCB layouts are flexible print circuits (FPCs) responsible for connections that enable 5G communication in ADAS and AV applications. Any design deficiencies within these layouts can negatively impact FPC transmission characteristics responsible for vehicle perception.
To address these challenges, Flexium uses Ansys simulation software for the electromagnetic, thermal and mechanical optimization of its FPC designs through layout and material changes. Ansys tools also helped Flexium set parameters for board layout and materials, then create a reference library for future mmWave design verification.
“Ansys delivers the greatest predictive accuracy and yields the strongest results for us during PCB layout analysis critical to today's ADAS and AV applications,” says Ming-Chi Cheng, president of Flexium. “Looking beyond 5G, we will continue to reference Ansys simulation to discover new methods for optical integration and communication that will help shape the future of our mmWave antenna module designs.”
“With Ansys, global PCB industry leaders like Flexium realize the freedom to explore possibilities in board application design, and successfully develop forward-thinking antenna solutions for high-frequency signal transceiver applications,” says John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys. “As the momentum behind miniaturization continues to build, our simulation solvers will accelerate the satellite, driverless, and related wireless signal modules powering this trend.”
Sources: Press materials received from the company and additional information gleaned from the company’s website.
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